发明名称 METHOD OF DETERMINING STABILIZATION OF SURFACE OF SILICON WAFER AND METHOD OF MANUFACTURING SILICON WAFER
摘要 PROBLEM TO BE SOLVED: To provide a means for determining whether a wafer surface subjected to surface treatment is stabilized when minority carrier diffusion length in a silicon wafer is measured by an SPV method. SOLUTION: This method is used for determining the stabilization of the silicon wafer surface subjected to surface treatment. In this method, the diffusion length of minority carriers is measured for the silicon wafer subjected to surface treatment in at least two kinds of time constants by a surface optical voltage method, and it is determined whether the silicon wafer surface has been stabilized according to whether at least any one of ratios of the measured diffusion lengths has reached a target value. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007053123(A) 申请公布日期 2007.03.01
申请号 JP20050235105 申请日期 2005.08.15
申请人 SUMCO CORP 发明人 KUBOTA TSUYOSHI
分类号 H01L21/66 主分类号 H01L21/66
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