| 摘要 |
The invention is characterized in a printed wiring board having a wiring pattern including a pad for mounting a solder ball as a connection terminal, wherein the pad is constituted by laminating a conductive layer constituting the wiring pattern, a lower layer plating layer, and an upper layer plating layer in this order; an immediate vicinity region surrounding the pad is constituted by laminating the conductive layer, at least the lower layer plating layer in the lower layer plating layer and the higher layer plating layer, and a solder resist layer in the order; a thickness of the upper layer plating layer is a thickness negligible in comparison with respective thicknesses of the lower layer plating layer and the upper layer plating layer; and a height of an upper face of the pad does not exceed a height of an upper face of the immediate vicinity region.
|
