| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique to make effective use of a semiconductor chip with a die attach film attached thereto in a general lead frame product, to be more specific, to provide a technology to suppress the warping and resin cracks of a semiconductor device which is such that a semiconductor chip with a die attach film attached thereto is mounted on a tab and then is sealed by resin. SOLUTION: The semiconductor chip 4 is mounted on a frame tab 2 in the shape of a hollowed-out frame. The frame tab 2 and the semiconductor chip 4 are connected to each other using the die attach film 6 pasted to the overall rear face of the semiconductor chip 4. Then, the semiconductor chip 4 is sealed by a resin 8. At that time, the die attach film 6 attached to the rear face of the semiconductor chip 4 is brought into direct contact with the resin 8. COPYRIGHT: (C)2007,JPO&INPIT
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