| 摘要 |
PROBLEM TO BE SOLVED: To provide a workmanship prediction device which can reduce calculation quantity and calculation time necessary for predicting the workmanship of a wafer inplane through wafer inplane trend simulation. SOLUTION: The workmanship prediction device is provided with a uniform mesh data preparation unit 11 wherein a wafer inplane is divided by a uniform mesh and data concerning the inplane trend of the respective workmanship of a series of steps are prepared through prediction, a non-uniform mesh preparation unit 12 wherein the data are used to prepare a non-uniform mesh for dividing the wafer inplane unevenly for each of a series of steps, a common mesh preparation unit 13 wherein the finest mesh among the non-uniform mesh is selected as a common mesh in a specific area of the wafer inplane, a common mesh data preparation unit 14 to represent the workmanship of each of a series of steps by the common mesh, and a prediction unit 15 wherein the common mesh data are used to predict the workmanship after consecutive steps for each of the areas divided by the common mesh. COPYRIGHT: (C)2007,JPO&INPIT
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