| 摘要 |
PROBLEM TO BE SOLVED: To enhance working efficiency when manufacturing a semiconductor device. SOLUTION: Identification information (ID) of a product written in a mu chip 5 embedded in a multi-cavity substrate 9 is read by a mu chip reader 13 assembled in a loader part or the like of a manufacturing device 10, so as to identify the product. A data such as information (address or the like) of a substrate defective portion in the individual product and a manufacturing condition and the like is called out from a control server 11, based on the identified ID, and the identification of the defective position in the substrate, the determination of a specification, the setting for a manufacturing device 10, or the like is executed by a personal computer 12 LAN-connected to the control server 11. The product is started thereafter to be manufactured based on the positional information of the substrate defective portion and information of the manufacturing condition downloaded from the control server 11. COPYRIGHT: (C)2007,JPO&INPIT
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