ELECTROPROCESSING METHOD AND SUBSTRATE TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroprocessing method which is capable of leveling the surface of a metallic film on a substrate with fine irregularities at a low processing pressure and capable of processing the metallic film at a uniform processing rate over the entire surface of the metallic film, in the formation of wirings on the substrate by the damascene process. SOLUTION: The electroprocessing method comprises: arranging an electricity supply electrode 31 and a processing electrode 32 on a table 12; arranging an insulator 36 between the electricity supply electrode 31 and the processing electrode 32; bringing the substrate W into contact with the insulator 36 in a manner that the metallic film 6 is opposed against the electricity supply electrode 31 and the processing electrode 32; supplying first and second electrolyte solutions respectively into between the electricity supply electrode 31 and the substrate W and into between the processing electrode 32 and the substrate W in a state electrically insulated by the insulator 36; applying an electric voltage between the electricity supply electrode 31 and the processing electrode 32; and relatively moving a workpiece carrier 11 and the table 12 to perform the electroprocessing of the metallic film 6 on the substrate W. COPYRIGHT: (C)2007,JPO&INPIT