发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD
摘要 <p>An electronic component mounting device has a holding table (12) for holding a substrate; X, Y, and ? drive sources (14, 19, 20) for driving the holding table in horizontal directions; a mounting tool (5) for holding an electronic component (4) and mounting it on the upper surface of a side section of the substrate, a backup tool (22) provided so that it can be driven in the vertical direction and supporting the lower surface of the side section of the substrate when the electronic component is mounted on the upper surface of the side section of the substrate; a camera (24) for imaging the substrate and the electronic component before the electronic component is mounted on the substrate; and a control device (25) positionally aligning the substrate and the electronic component based on an image signal from the camera, causing the backup tool to be lifted to support the lower surface of the side section of the substrate, making the camera re-image the substrate in that state, and causing the substrate and the electronic component to be positionally re-aligned if there is a positional displacement between the substrate and the electronic component.</p>
申请公布号 WO2007023692(A1) 申请公布日期 2007.03.01
申请号 WO2006JP315844 申请日期 2006.08.10
申请人 SHIBAURA MECHATRONICS CORPORATION;HIROSE, KEIGOU 发明人 HIROSE, KEIGOU
分类号 H05K13/04;H01L21/60;H05K13/08 主分类号 H05K13/04
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