PROBE DEVICE AND METHOD OF REGULATING CONTACT PRESSURE BETWEEN OBJECT TO BE INSPECTED AND PROBE

摘要

Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card (2) has a contactor (11) for supporting a probe (10), a printed wiring board (13) electrically connected to the contactor (11), and a reinforcement member (14). On the upper surface side of the probe card (2) is provided a top plate (70) connected to the reinforcement member (14) by a connection member (80). A groove (90) is formed in the upper surface of the top plate (70), and a strain gauge (91) is attached at the groove (90). When a wafer (W) and the probe (10) are in contact with each other, an upward load acts on the probe card (2) by pressure caused by the contact, and the load causes strain in the top plate (70). The amount of the strain in the top plate (70) is measured, and contact pressure between the wafer (W) and the probe (10) is regulated and set based on the amount of the strain.