| 摘要 |
<p>The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500°C, in particular, not less than 900°C. The raw material metal used as raw material of the solder powder comprises 3 to 12 % by weight of Zn, 1.0 to 15 % by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. The powder may further contain one or more of Bi, In, Sb, Mg, Ag, Au, in a total amount of up to 5% by weight. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided. The solder powder has a mean particle size from 5 to 100 microns.</p> |
