METHOD FOR MANUFACTURING THREE DIMENSIONAL PDMS STRUCTURE

摘要

A method for forming a three-dimensional PDMS(polydimethysiloxane) structure is provided to form a three-dimensional having an arbitrary shape with a small alignment error by using a soft PDMS bonding of a PDMS layer whose part is hardened. A first mask layer pattern is formed on a semiconductor substrate. A second mask layer pattern is formed on the resultant structure. The semiconductor substrate is etched by using the second mask layer pattern as a mask. The second mask layer pattern is removed, and the semiconductor substrate is etched by using the first mask layer pattern as a mask to form a step. A planarized first PDMS layer pattern is formed on the semiconductor substrate, exposing the upper surface of the step. A sacrificial layer pattern is formed on the step and the first PDMS layer pattern. A second PDMS layer hardened to a predetermined degree is bonded to the upper part of the resultant structure. The sacrificial layer pattern and the semiconductor substrate are removed. A capping PDMS layer is formed on the surface of the second PDMS layer exposed by the removal of the semiconductor substrate.