| 发明名称 |
COMPOSITION OF A SOLDER, AND METHOD OF MANUFACTURING A SOLDER CONNECTION |
| 摘要 |
The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices. <IMAGE> |
| 申请公布号 |
EP1755820(A1) |
申请公布日期 |
2007.02.28 |
| 申请号 |
EP20050736214 |
申请日期 |
2005.05.11 |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;MAT-TECH B.V. |
发明人 |
VAN VEEN, NICOLAAS, J., A.;BIGLARI, MOHAMMAD, H. |
| 分类号 |
B23K35/02;B23K35/26;B23K35/28;H05K3/34 |
主分类号 |
B23K35/02 |
| 代理机构 |
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代理人 |
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