发明名称 |
Electronic package and circuit board having segmented contact pads |
摘要 |
<p>An electronic package (10) is provided having a circuit board (36) including a substrate electrical circuitry including circuit traces and first and second contacts (22 and 24) for connecting to surface mount device(s) (16A). The first and second contacts (22 and 24) each have multiple components including first and second pads (22A and 22B). The first pad (22A) is separate from the second pad (22B) to allow for low cost and easy testing of the electrical circuit.</p> |
申请公布号 |
EP1758436(A1) |
申请公布日期 |
2007.02.28 |
申请号 |
EP20060076589 |
申请日期 |
2006.08.17 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
CHAN, AIK HUANG |
分类号 |
H05K3/34;H05K13/08 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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