| 摘要 |
<p>An embodiment of the invention pertains to a two stage process that facilitates the formation of a substantially uniform layer. A material is isotropically deposited on a re-entry shaped surface topography and a substrate resulting in a non-wetting film on the re-entry shaped surface topography and the substrate. Regions of the non-wetting film that are not shadowed by the re-entry shaped surface topography are anisotropically removed resulting in non-wetting shadowed films only in the regions that are shadowed by the re-entry shaped surface topography. The non-wetting shadowed films are non-wetting to a subsequently deposited layer. The non-wetting shadowed films reduce pileup at the edges, and so the subsequently deposited layer has a substantially uniform layer thickness.</p> |
