LIGHT EMITTING DIODE PACKAGE

摘要

An LED package is provided to improve optical efficiency by 10~15 percent by having light transmitting resin whose upper surface is of a dome type such that the light transmitting resin is deposited to cover a light emitting chip included in a lower cavity of a package body. A light emitting chip(110a) generated light when power is applied. A package body(120) includes a lower cavity(121) and an upper cavity(123). The light emitting chip is disposed in the lower cavity. A reflection member(125,127) for reflecting the light generated from the light emitting chip is included in the inner surface of the upper cavity. A lead electrode part(130a) is fixed to the package body, electrically connected to the light emitting chip and composed of first and second leadframes(132a,134a) respectively bonded to the light emitting chip by using a metal wire(114) as a medium. The light emitting chip is covered with light transmitting resin(140) that is deposited in the lower cavity to have an upward convex dome type in a boundary region between the upper and the lower cavities.