发明名称 |
METHOD OF PRODUCING A SURFACE-TREATED COPPER FOIL FOR A PRINTED WIRING BOARD |
摘要 |
AN OBJECT OF THE INVENTION IS TO PROVIDE A SURFACE-TREATED COPPER FOIL CAPABLE OF CONSISTENTLY ATTAINING A PERCENT LOSS IN RESISTANCE AGAINST HYDROCHLORIC ACID DEGRADATION OF 10OR LESS AS MEASURED ON A COPPER PATTERN PREPARED FROM THE COPPER FOIL AND HAVING A LINE WIDHT OF 0.2 MM,BY BRINGING OUT THE MAXIMUM EFFECT OF THE SILANE COUPLING AGENT EMPLOYED IN COPPER FOIL COATED WITH AN ANTI-CORROSIVE LAYER FORMED OF A ZINC-COPPER-NICKEL TERNARY ALLOY. ANOTHER OBJECT IS TO IMPART EXCELLENT MOISTURE RESISTANCE TO THE SURFACE-TREATED COPPER FOIL. IN ORDER TO ATTAIN THESE OBJECTS, THE INVENTION PROVIDES A SURFACE-TREATED COPPER FOIL FOR PRODUCING PRINTED WIRING BOARDS WHOSE SURFACE HAS BEEN SUBJECTED TO NODULAR TREATMENT AND ANTI-CORROSION TREATMENT, WHEREIN THE ANTI-CORROSION TREATMENT INCLUDES FORMING A ZINC-COPPER-NICKEL TERNARY ALLOY ANTI-CORROSION PLATING LAYER ON A SURFACE OF THE COPPER FOIL; FORMING AN ELECTROLYTIC CHORMATE LAYER ON THE ANTI-CORRISON PLATING LAYER, FORMINGT A SILANE-COUPLING-AGENT-ADSORBED LAYER ON THE ELECTROLYTIC CHORMATE LAYER; AND DRYING THE COPPER FOIL FOR 2-6 SECONDS SUCH THAT THE COPPER FOIL REACHES 105°C-200°C.(FIGURE 1) |
申请公布号 |
MY128582(A) |
申请公布日期 |
2007.02.28 |
申请号 |
MY2001PI00316 |
申请日期 |
2001.01.23 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
MASAKAZU MITSUHASHI;TAKASHI KATAOKA;NAOTOMI TAKAHASHI |
分类号 |
C23C28/02;C25D11/38;C23C22/00;C23C22/24;C23C28/00;C23F15/00;C25D1/04;C25D3/38;C25D3/56;C25D5/10;C25D5/16;C25D5/48;C25D7/00;C25D7/06;H05K3/38 |
主分类号 |
C23C28/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|