发明名称 METHOD OF PRODUCING A SURFACE-TREATED COPPER FOIL FOR A PRINTED WIRING BOARD
摘要 AN OBJECT OF THE INVENTION IS TO PROVIDE A SURFACE-TREATED COPPER FOIL CAPABLE OF CONSISTENTLY ATTAINING A PERCENT LOSS IN RESISTANCE AGAINST HYDROCHLORIC ACID DEGRADATION OF 10OR LESS AS MEASURED ON A COPPER PATTERN PREPARED FROM THE COPPER FOIL AND HAVING A LINE WIDHT OF 0.2 MM,BY BRINGING OUT THE MAXIMUM EFFECT OF THE SILANE COUPLING AGENT EMPLOYED IN COPPER FOIL COATED WITH AN ANTI-CORROSIVE LAYER FORMED OF A ZINC-COPPER-NICKEL TERNARY ALLOY. ANOTHER OBJECT IS TO IMPART EXCELLENT MOISTURE RESISTANCE TO THE SURFACE-TREATED COPPER FOIL. IN ORDER TO ATTAIN THESE OBJECTS, THE INVENTION PROVIDES A SURFACE-TREATED COPPER FOIL FOR PRODUCING PRINTED WIRING BOARDS WHOSE SURFACE HAS BEEN SUBJECTED TO NODULAR TREATMENT AND ANTI-CORROSION TREATMENT, WHEREIN THE ANTI-CORROSION TREATMENT INCLUDES FORMING A ZINC-COPPER-NICKEL TERNARY ALLOY ANTI-CORROSION PLATING LAYER ON A SURFACE OF THE COPPER FOIL; FORMING AN ELECTROLYTIC CHORMATE LAYER ON THE ANTI-CORRISON PLATING LAYER, FORMINGT A SILANE-COUPLING-AGENT-ADSORBED LAYER ON THE ELECTROLYTIC CHORMATE LAYER; AND DRYING THE COPPER FOIL FOR 2-6 SECONDS SUCH THAT THE COPPER FOIL REACHES 105°C-200°C.(FIGURE 1)
申请公布号 MY128582(A) 申请公布日期 2007.02.28
申请号 MY2001PI00316 申请日期 2001.01.23
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 MASAKAZU MITSUHASHI;TAKASHI KATAOKA;NAOTOMI TAKAHASHI
分类号 C23C28/02;C25D11/38;C23C22/00;C23C22/24;C23C28/00;C23F15/00;C25D1/04;C25D3/38;C25D3/56;C25D5/10;C25D5/16;C25D5/48;C25D7/00;C25D7/06;H05K3/38 主分类号 C23C28/02
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