发明名称 |
Chemical mechanical polishing pad and chemical mechanical polishing method |
摘要 |
A chemical mechanical polishing pad. The pad contains a water-insoluble matrix and Water-soluble particles dispersed in the water-insoluble matrix material and has a polishing surface and a non-polishing surface on a side opposite to the polishing surface. The pad has a light transmitting area which optically communicates from the polishing surface to the non-polishing surface. The non-polishing surface of the light transmitting area has a surface roughness (Ra) of 10 pm or less.
|
申请公布号 |
US7183213(B2) |
申请公布日期 |
2007.02.27 |
申请号 |
US20040892096 |
申请日期 |
2004.07.16 |
申请人 |
JSR CORPORATION |
发明人 |
SHIHO HIROSHI;HOSAKA YUKIO;HASEGAWA KOU;KAWAHASHI NOBUO |
分类号 |
H01L21/302;B24B37/013;B24B37/04;B24B37/20 |
主分类号 |
H01L21/302 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|