| 摘要 |
A semiconductor wafer (10) provided with columnar electrodes (24) which have plated nickel (42), palladium (44), and gold (46) films successively formed at the top thereof, or have a plated solder film (47) at their top. The semiconductor wafer (10) can be preferably used for producing a chip-sized semiconductor device provided with columnar electrodes (24) to which an external connection terminal, such as a solder ball (50), is to be bonded. Methods of producing the semiconductor wafer (10) and device by use of plating are also disclosed. <IMAGE> |
