| 摘要 |
A multilayer wiring board ( 11 ) is provided which includes a core substrate ( 12 ) including a plurality of through-holes ( 15 ). The through-holes ( 15 ) include through-hole conductors ( 17 ) on the inner walls of corresponding penetration holes ( 16 ) of a diameter of 200 mum or less. Interlayer insulating layers ( 31, 32 ) are disposed on opposite sides of the principal planes ( 13, 14 ) of the core substrate ( 12 ). Wiring layers ( 23, 24 ) are disposed on the surface of interlayer insulating layers ( 31, 32 ). The through-holes ( 15 ) are filled with a hardened filling material ( 18 ). Lid conductors ( 21, 22 ) close the openings of the through-holes ( 15 ). The value of linear expansion of the hardened filling material ( 18 ) is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.
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