发明名称 |
Heating and cooling apparatus, and vacuum processing apparatus equipped with this apparatus |
摘要 |
A heating and cooling apparatus with which batch processing is possible and throughput can be increased, and furthermore which is more compact and uses less energy. A substrate heating chamber and a substrate cooling chamber each capable of simultaneously holding a plurality of substrates are provided in a thermally separated state in a heating and cooling apparatus with a single vacuum processing chamber. The substrate heating chamber is equipped with a plurality of communicating or non-communicating substrate holding spaces. The substrate cooling chamber is also equipped with a plurality of communicating or non-communicating substrate holding spaces. The communicating substrate holding spaces allow the batch heat treatment of substrates, while the non-communicating substrate holding spaces allow the batch or individual processing of substrates.
|
申请公布号 |
US7182122(B2) |
申请公布日期 |
2007.02.27 |
申请号 |
US20010906130 |
申请日期 |
2001.07.17 |
申请人 |
ANELVA CORPORATION |
发明人 |
KOGUCHI TOSHIAKI;WATANABE KAZUHITO;TAKAHASHI NOBUYUKI |
分类号 |
B01J3/00;F25B29/00;C23C14/56;C23C16/44;H01L21/00;H01L21/02;H01L21/203;H01L21/205;H01L21/302;H01L21/3065 |
主分类号 |
B01J3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|