发明名称 |
Method of bonding adherend |
摘要 |
By using a high viscosity moisture-curable adhesive composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl (meth)acrylate monomer unit(s) and (D) an epoxy resin, it becomes possible to bond an adherend to a substrate without open time and without temporary tacking after application.
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申请公布号 |
US7182833(B2) |
申请公布日期 |
2007.02.27 |
申请号 |
US20030258391 |
申请日期 |
2003.02.10 |
申请人 |
KANEKA CORPORATION |
发明人 |
ANDO KATSUHIRO;TAKASE JUNJI;KAWAKUBO FUMIO |
分类号 |
C09J133/08;E04F13/21;C08F8/42;C08G59/40;C08G65/336;C08L23/08;C08L23/26;C08L63/00;C08L71/00;C08L71/02;C09J5/00;C09J5/06;C09J123/26;C09J125/02;C09J133/06;C09J163/00;C09J171/02;C09J183/04 |
主分类号 |
C09J133/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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