发明名称 Semiconductor device having resin anti-bleed feature
摘要 A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the substrate in the peripheral region thereof, wherein the adhesive comprises a plurality of components, such as a metal and a resin. A first barrier is formed on the surface of the substrate generally between the adhesive and the exterior region, wherein the first barrier generally prevents one or more of the plurality of components of the adhesive from bleeding onto the exterior region of the surface of the substrate.
申请公布号 US7183657(B2) 申请公布日期 2007.02.27
申请号 US20040947695 申请日期 2004.09.23
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 FURTAW ROBERT JOHN;ABBOTT JOHN HENRY;HOFFMAN EMILY ELLEN
分类号 H01L23/48;H01L23/29;H01L23/34;H01L23/52;H01L29/40 主分类号 H01L23/48
代理机构 代理人
主权项
地址