Multilayer interconnection board and production method thereof

摘要

A multilayer interconnection board is disclosed that allows reliable electrical connection between an interconnection having a large width and a large area and a via provided in a via hole formed by pressing a tool against resin. A projecting portion for electrical connection is formed integrally with the insulating member and in a second interconnection groove having a width and an area greater than those of a first interconnection groove. While a first interconnection is being deposited in the first interconnection groove and a second interconnection is being deposited in the second interconnection groove, the projecting portion is formed in the second interconnection groove and a metal plating film is provided on the projecting portion at the same time, so as to electrically connect the second interconnection with the via.