发明名称 |
Microelectronic component assemblies having lead frames adapted to reduce package bow |
摘要 |
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members. |
申请公布号 |
US7183485(B2) |
申请公布日期 |
2007.02.27 |
申请号 |
US20030386757 |
申请日期 |
2003.03.11 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
GROOTHUIS STEVEN K.;SMITH STEVEN R.;BAUGHMAN STEVE;BALL BERNARD;O'CONNOR T. MICHAEL |
分类号 |
H05K5/06;H01L23/31;H01L23/495 |
主分类号 |
H05K5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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