DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A double-encapsulated semiconductor package is provided to perform an encapsulation process regardless of the position of a second window formed in a wiring board by forming a second resin encapsulation part by a potting method. A complex chip(110) has a plurality of normal pads(114) and a random pad(116) formed on an active surface(112). A wiring board(130) has a first surface(131) and a second surface(133). The active surface of the complex chip is attached to the first surface. First and second windows(135,137) are formed in the wiring board to expose the normal pad and the random pad, respectively. The normal pad and the random pad are electrically connected to the wiring board through the first and the second windows by a plurality of bonding wires(140). A semiconductor chip on the first surface and the first window on the second surface are encapsulated together to form a first resin encapsulation part(151). The second window on the second surface is encapsulated by a potting method to form a second resin encapsulation part(153). The normal pad can be formed on the edge region of the active surface, and the random pad can be formed inside the edge region of the active region.