发明名称 |
Method for dicing semiconductor wafers |
摘要 |
A method is disclosed for dicing a wafer having a base material with a diamond structure. The wafer first undergoes a polishing process, in which a predetermined portion of the wafer is polished away from its back side. The wafer is then diced through at least one line along a direction at a predetermined offset angle from a natural cleavage direction of the diamond structure.
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申请公布号 |
US7183137(B2) |
申请公布日期 |
2007.02.27 |
申请号 |
US20030725697 |
申请日期 |
2003.12.01 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
LEE HSIN-HUI;HUANG CHIEN-CHAO;WANG CHAO-HSIUNG;YANG FU-LIANG;HU CHENMING |
分类号 |
H01L21/301;H01L21/50;B28D5/00;H01L21/304;H01L21/78 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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