| 摘要 |
A method for fabricating an LED package is provided to remarkably reduce optical loss capable of occurring in front emission of light by using a characteristic of backlight. A phosphor(103) is coated as a film type or a paste type on a substrate(100) having a lens. The phosphor can be die adhesive. An LED chip(104) is formed on the coated phosphor by a wire bonding process or a flip-chip bonding process. After a reflection plate(106) is formed on the phosphor including the LED chip, a molding process is performed.
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