发明名称 |
ECP polymer additives and method for reducing overburden and defects |
摘要 |
Electrochemical plating polymer additives and method which reduces metal overburden in an electroplated metal while optimizing gap fill capability are disclosed. The polymer additives are provided in an electrochemical plating bath solution and may include low cationic charge density co-polymers having aromatic and amine functional group monomers. The low cationic charge density polymers may include benzene or pyrollidone functional group monomers and imidazole or imidazole derivative functional group monomers.
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申请公布号 |
US7182849(B2) |
申请公布日期 |
2007.02.27 |
申请号 |
US20040788571 |
申请日期 |
2004.02.27 |
申请人 |
TAIWAN SEMICONDUCOTR MANUFACTURING CO., LTD. |
发明人 |
SHIH CHIEN-HSUEH;SHUE SHAULIN |
分类号 |
C25D3/00;C25D3/02;C25D3/38;C25D3/56;H01L21/288;H01L21/445 |
主分类号 |
C25D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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