发明名称 Method for operating a semiconductor processing apparatus
摘要 A method for operating a semiconductor processing apparatus that plasma-processes a semiconductor wafer mounted on a stage placed in a container using a plasma generated therein. The method includes setting a temperature of the semiconductor wafer, and controlling an operation of the semiconductor processing apparatus based on information about the temperature of the semiconductor wafer which is set.
申请公布号 US7183715(B2) 申请公布日期 2007.02.27
申请号 US20040997888 申请日期 2004.11.29
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 KANNO SEIICHIRO;NISHIO RYOJI;YOSHIOKA KEN;KANAI SABUROU;KIHARA HIDEKI;YAMAMOTO HIDEYUKI
分类号 H01J7/24;H01L21/00 主分类号 H01J7/24
代理机构 代理人
主权项
地址