发明名称 Electronic apparatus and shielding structure for heat dissipation openings
摘要 An electrical apparatus includes a housing, a shielding plate, a first elastic element, and a second elastic element. In this case, the housing has at least one heat dissipation opening. The shielding plate has at least one first hole, a first sidewall and a second sidewall. The shielding plate is disposed parallel to at least one part of the housing. When the shielding plate is moved, the first hole and the heat dissipation opening are aligned. At least one part of the first elastic element contacts the first sidewall. The first elastic element is made of a shape memory alloy. At least one part of the second elastic element contacts the second sidewall. The shielding plate is movable between the first elastic element and the second elastic element.
申请公布号 US7184278(B2) 申请公布日期 2007.02.27
申请号 US20050159319 申请日期 2005.06.23
申请人 ASUSTEK COMPUTER INC. 发明人 TSAI CHIH SHENG
分类号 H05K9/00;G06F1/16;G06F1/20 主分类号 H05K9/00
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