| 摘要 |
A probe card for inspecting a semiconductor wafer is provided to prevent a contact error by using a pad for stably connecting a pattern part of a printed circuit board with each of probing parts of needles. A probe card includes a plurality of vertical needles for determining a bad state of a semiconductor wafer by connecting the semiconductor wafer with a pattern part(41) of a printed circuit board(40). A conductive pad is formed on the pattern part of the printed circuit board in order to cover the pattern part. A guide member is formed at the pad in order to connect a probing part of each needle through the pad to the pattern part.
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