发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND INTERLAYER DIELECTRICS AND MICROLENSES MADE THEREFROM
摘要 <p>[PROBLEMS] To provide a positive photosensitive resin composition which is free from contamination and exhibits high sensitivity without deterioration in transparency, retention of film thickness, and other characteristics; and interlayer dielectrics and micro lenses, made from the composition. [MEANS FOR SOLVING PROBLEMS] A positive photosensitive resin composition characterized by comprising the following components (A) and (B) and a solvent: (A) at least one alkali-soluble resin selected from among copolymers obtained by using as the essential monomer at least one monomer selected from the group consisting of unsaturated carboxylic acids and derivatives thereof, and (B) a 1,2-quinonediazide compound represented by the general formula (1): wherein D1 to D3 are each independently hydrogen or an organic group bearing a 1,2-quinonediazide group, with the proviso that at least one of D1 to D3 is an organic group bearing an 1,2-quinone- diazide group; n is an integer of 1 to 3; and R is a monovalent organic group.</p>
申请公布号 KR20070022108(A) 申请公布日期 2007.02.23
申请号 KR20067027245 申请日期 2005.05.25
申请人 发明人
分类号 G02B3/00;G03F7/004;G03F7/022;G03F7/023;H01L21/027 主分类号 G02B3/00
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