| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device excellent in mounting performance. <P>SOLUTION: The semiconductor device includes a semiconductor chip 10; a plurality of electrodes 14 formed on the semiconductor chip 10 and arranged along one side 15 of the semiconductor chip 10; a resin protrusion 20 formed on the semiconductor chip 10 and having a shape extending in a direction crossing the side 15; and a plurality of electric connection portions 30 formed on the resin protrusion 20 and electrically connected to the electrodes 14. <P>COPYRIGHT: (C)2007,JPO&INPIT |
