发明名称 EPITAXIAL WAFER FOR LED AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an epitaxial wafer for an LED reducing oxygen as impurities and being capable of manufacturing a red light-emitting diode with a high brightness and a high yield and the epitaxial wafer for the LED. <P>SOLUTION: In the manufacturing method for the epitaxial wafer having a single hetero-junction structure, an AlGaAs active layer and an AlGaAs clad layer are formed successively on a substrate by a liquid-phase epitaxial method. In the manufacturing method, a raw-material solution and a graphite growth jig are purified by holding a growth in-oven temperature for approximately two hr at approximately 250&deg;C before the growth of an epitaxial layer, and continuously conducting an evacuation and an H<SB>2</SB>purge during the holding of the growth in-oven temperature, and a growth is conducted. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007048875(A) 申请公布日期 2007.02.22
申请号 JP20050230637 申请日期 2005.08.09
申请人 HITACHI CABLE LTD 发明人 SUGAWARA TEPPEI;SHIMADA NORIO;YAMAMOTO SHUNSUKE
分类号 H01L21/208;H01L33/30 主分类号 H01L21/208
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