| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which can simply control side etching in a required portion. SOLUTION: In the method, a wiring pattern 20 is formed so that an etching resist is formed on the metallic foil laminated on an insulating resin board, and etching is carried out via the etching resist. The wiring pattern 20 consists of a circuit pattern 22 which constitutes an electric circuit, and a dummy pattern 21 separately provided near the circuit pattern 22. By this way, the speed of advance of etching to the circuit pattern 22 is eased so that the side etching of the circuit pattern 22 can be prevented. COPYRIGHT: (C)2007,JPO&INPIT
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