Mehrschichtige Hochfrequenzvorrichtung mit Planarantenne und Herstellungsverfahren

摘要

An electronic component module has a device-side module A and an antenna-side module B. The device-side module A is equipped with a first dielectric substrate 11 that is formed with a first transmission line 11a and a high-frequency device 13 that is mounted on the first dielectric substrate 11 and is connected to the first transmission line 11a. The antenna-side module B is equipped with a second dielectric substrate 12 that is laid on the first dielectric substrate 11 in such a manner that they are arranged in a lamination direction and that is formed with a second transmission line 12a that is electrically connected to the first transmission line 11, and an antenna element 14 that is provided on the second dielectric substrate 12 and electrically connected to the high-frequency device 13 via the second transmission line 12a and the first transmission line 11a.