| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a gap from occurring between a lead wire and a light emitting device due to the bending of the lead wire which is extracted outside the light emitting device in the light emitting device in which a solid-state light emitting device serve as a light source. <P>SOLUTION: The light emitting device includes an LED 1 that serves as a light source, a plurality of lead wires 2 connected to the LED 1, and a resin molding 3 which is configured by sealing up the LED 1 and a part of the lead wires 2 with resin material. The sides of the resin molding 3 through which the lead wires 2 are extracted outside are provided with projections 4 projecting from the resin molding 3 so as to cover the roots of the lead wires 2, and at least one or more constrictions 4a are provided to each of the projections 4 in a circumferential direction so as to buffer the stress induced by the bending of the lead wires 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
