| 摘要 |
PROBLEM TO BE SOLVED: To provide a frame for dicing of a semiconductor wafer that suppresses and prevents the an adhesive from adhering to a die and remaining in the frame, and prevents a dicing layer from deviating and disengaging from the frame even if applying large pressure. SOLUTION: The frame for dicing a semiconductor wafer comprises a hollow frame 1 for storing and surrounding the 12-inch semiconductor wafer, and a flexible dicing layer 20 for viscously holding the semiconductor wafer affixed and stored on the back of the frame 1 detachably, thus performing the injection molding of the frame 1 by a molding for injection molding. A corner section 5 in a knife edge shape having a radius of 0.2 mm or smaller without any rounding essentially is formed on an inner-periphery surface 2 and the back of the frame 1, and an angleθof 90°or smaller, preferably 45-89°is formed. Even if an EVA-based dicing layer 20 is used, the dicing layer 20 does not slide at a corner section 5, thus preventing the dicing layer 20 from deviating or separating from the frame 1 in expand work. COPYRIGHT: (C)2007,JPO&INPIT |
