发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which has high productivity and can efficiently activate the impurities in source and drain regions. SOLUTION: The semiconductor device manufacturing method includes processes of forming a semiconductor film on a substrate; forming a gate insulation film on the semiconductor film: forming a gate electrode on the gate insulation film; selectively implanting impurities into predetermined regions of the semiconductor film to form the source and drain regions; forming an interlayer insulation film on the gate insulation film and on the gate electrode; forming a light absorption layer on the interlayer insulation film; forming a protection insulation layer on the light absorption layer; and irradiating light on the light absorption layer via the protection insulation film, and activating the impurities in the source and drain regions by the heat from the light absorption layer heated by irradiation of light. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007048892(A) 申请公布日期 2007.02.22
申请号 JP20050231008 申请日期 2005.08.09
申请人 ADVANCED LCD TECHNOLOGIES DEVELOPMENT CENTER CO LTD 发明人 NAKAMURA HIROYOSHI
分类号 H01L21/336;H01L21/20;H01L21/265;H01L29/786 主分类号 H01L21/336
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