| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer chamfering device with which an original target of coolant liquid is achieved for cooling a wafer and a grinding stone and for removing/cleaning grinding waste, and coolant liquid can efficiently be supplied. SOLUTION: The wafer chamfering device 10 is provided with coolant nozzles 71A and 71B supplying coolant liquid 91A to the inner surface of the wafer W. Supplied coolant liquid 91A is made to spread to an outer periphery from the inner surface on a wafer surface. During chamfering work by helical grinding using the formed grinding stone, or chamfering work of a notch N, coolant liquid 91A can efficiently be supplied to a work point. COPYRIGHT: (C)2007,JPO&INPIT
|
