发明名称 CONDUCTIVE PARTICLE TRANSCRIPTION SHEET, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive particle transcription sheet provided with low connection resistance, high insulation reliability, and superior micro-circuit connectivity. SOLUTION: This is the conductive particle transcription sheet to transcribe the conductive particles onto a connection face of a connection terminal, consisting of a support, an adhesive layer formed on the surface of the support, and the conductive particles adhered to the surface of the adhesive layer. By using the conductive particle transcription sheet in which the conductive particles are arranged and aligned for the purpose that the average particle spacing between the adjacent conductive particles becomes 0.3 to 5 times the average particle diameter of the conductive particles, the conductive particles are transcribed onto the connection face of the connection terminal of electronic parts, and a connection structure is obtained by connecting the connection face of the connection terminal onto which the conductive particles have been transcribed to the connection face of other connection terminals. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007048687(A) 申请公布日期 2007.02.22
申请号 JP20050234082 申请日期 2005.08.12
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 OTANI AKIRA
分类号 H01R11/01;H01L21/60;H01R43/00 主分类号 H01R11/01
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