发明名称 MANUFACTURING METHOD OF SUBSTRATE WITH TRANSPARENT CONDUCTIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate with a transparent conductive film capable of forming a transparent conductive film having an excellent uniformity at low cost, when a transparent conductive film having high crystallinity and low resistance is installed on a substrate with inferior thermal resistance. SOLUTION: The manufacturing method of a substrate with transparent conductive film having a transparent conductive film on one face of a first substrate, comprises a process A in which a transparent conductive film is formed on one face of a second substrate using the second substrate having a higher thermal resistance than the first substrate, a process B in which the transparent conductive film is pasted on one face of the first substrate through an adhesion means, and a process C in which, using a removal means of removing only the second substrate, a laminate consisting of the first substrate, the adhesion means, and the transparent conductive film is left remaining, at least in that order. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007048564(A) 申请公布日期 2007.02.22
申请号 JP20050230933 申请日期 2005.08.09
申请人 FUJIKURA LTD 发明人 SHIBATA HIDEYUKI
分类号 H01B13/00;B05D5/12 主分类号 H01B13/00
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