ADHESIVE COMPOSITION AND ADHESIVE FILM USING IT, AND PROCESS FOR PRODUCING ADHESIVELY BONDED PRODUCT

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition that is cured by heating in a shorter time, gives a cured product having excellent properties such as adhesion in particular and the like and is excellent in storage stability at a room temperature, and to provide an adhesive or an adhesive film through use of which semiconductor elements can be laminated and adhesively bonded parallel relationship with one another. SOLUTION: The adhesive composition comprises (A) a thermal acid generating agent comprising a sulfonium salt represented by formula (1), (B) an acid curable compound and (C) a pressure-sensitive adhesive polymer (provided that in formula (1), R1denotes a group selected from the group consisting of a phenacyl group, an allyl group, an alkoxy group and an aryloxy group; and R2and R3each independently denote a group selected from the group consisting of a phenacyl group, an allyl group, an alkoxy group, an aryloxy group, an alkyl group and an alkenyl group). COPYRIGHT: (C)2007,JPO&INPIT