| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor that inhibits connection failures and an inner lead from getting peeled off at wire bonding, misregistration of substrate for mounting a lead frame and a semiconductor device, etc. SOLUTION: Presented here is an adhesive film for a semiconductor that has an adhesives layer (A) 2 on one surface of a support film 1 and an adhesives layer (B) 3 on its other surface. The adhesives layer (A) 2 is a layer that is formed by curing a photopolymer composition, and as to an adhesive film with four sides of 1 cm, when the adhesives layer (A) 2 side is hot-pressed to a metal plate 4 for 5 seconds at 280°C, by applying a load of 25 kgf, the value found by dividing an average value F(A) of extruded lengths at the center of each side by the adhesives layer's thickness is less than 2, and the value at the adhesives layer (B) 3 side is larger than 2 and smaller than 30. COPYRIGHT: (C)2007,JPO&INPIT |
