SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

摘要

Provided is a substrate polishing apparatus which can smoothly polish a glass substrate for a long time. An intermediate sheet, which has a high rigidity in a tensile direction compared with that of a suction sheet, is sandwiched between a film body and the suction sheet and bonded. There are cases where the film body expands and contracts in the tensile direction due to polish resistance generated during polishing, and that peeling is generated between the intermediate sheet and the film body due to expansion and contraction of the film body. Since the intermediate sheet is arranged between the film body and the suction sheet, the intermediate sheet does not expand nor contact in the tensile direction between the suction sheet wherein expansion and contraction are limited due to suction of the glass substrate (G) and the intermediate sheet having higher rigidity in the tensile direction than that of the suction sheet. Thus, relative shift is not generated and the suction sheet is prevented from peeling and rolling up from the intermediate sheet.