PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a cured product layer which hardly contaminates a plating solution and exhibits excellent plating resistance when electroless plating is carried out.

SOLUTION: The photosensitive resin composition contains (A) a binder, (B) a photopolymerizable compound containing at least a vinyl urethane compound represented by formula (1), and having polymerizable ethylenically unsaturated groups in a molecule, (C) a photopolymerization initiator and (D) a benzotriazole compound represented by formula (2).

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