| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump forming method to form bumps in the uniform height using uniform quantity of solder. SOLUTION: A resist mask 5 providing aperture 5a is formed on a substrate 1 under the condition that the front surface of an electrode 2 provided on the substrate 1 is exposed. Next, a close contact film 7 having wettability of solder is formed under the condition that at least the side wall of the aperture 5a is covered. Subsequently, the solder is embedded to form a solder layer 8 to the aperture 5a where the close contact film 7 is provided under the condition that the solder layer 8 overflows to the upper part of the front surface of the resist mask 5 and the reflow process is conducted to the solder layer 8. Thereafter, a bump 9 composed of the solder layer 8' is formed by removing the excessive portion of the solder layer 8' after the reflow process, until the height becomes almost equal to the front surface of the resist mask 5 and the resist mask 5 is then removed. COPYRIGHT: (C)2007,JPO&INPIT
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