| 摘要 |
The present invention discloses a thermal laminate for dissipating heat generated in the vicinity of an installed PCMCIA card. The thermal laminate includes top film, middle gap filler and bottom layers. The top film layer provides a protective, non-resistive, low friction surface with a soft conformal interface for enhancing the workability of the thermal laminate. The middle gap filler layer is disposed underneath the top film layer and provides a conformal thermal pathway for the heat radiation emitted from the PCMCIA card. The bottom layer is disposed underneath the middle gap filler layer and provides a grip to the middle gap filler and top film layers. The bottom layer is made from either a thermal adhesive layer or a copper foil layer. The thermal laminate utilizes sliding contacts for proper housing between PCMCIA card and heat sink surfaces to provide better thermal management. |
