METHOD OF FORMING GROOVE IN CHEMICAL MECHANICAL POLISHING PAD UTILIZING LASER ABLATION

摘要

PROBLEM TO BE SOLVED: To provide a method of forming an improved polishing pad for chemical mechanical planarization which has increased texture and increased surface area for carrying slurry, and for improving the polishing performance means of laser ablation.

SOLUTION: A method of forming a polishing pad comprises a step of providing a laser for cutting grooves in the polishing pad, and a step of providing a beam splitter to split a laser beam from the laser. The method further comprises a step of splitting the beam from the laser, to provide multiple laser beams to the polishing pad, and the multiple laser beams have effective cutting sections that at least overlap with each other.

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