发明名称 CUTTING DEVICE AND METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide cutting device and cutting method for cutting a cutting object in a stably held state without requiring an adhering process and a peeling process. <P>SOLUTION: This cutting device is provided with clamping parts 2 and 3 for clamping the cutting object (a rare-earth sintered magnet 1) before a cutting and cut pieces 1a after the cutting, and a cutting mechanism 4 (a rotary blade 4a) for cutting the cutting object in the direction orthogonal to the clamping direction by the clamping parts 2 and 3. At the time of the cutting, the rare-earth sintered magnet 1 is clamped by the clamping parts 2 and 3, and the rare earth sintered magnet 1 is cut by moving the rotary blade 4a in the direction substantially orthogonal to the clamping direction, for instance. Also after the cutting, each of the cut pieces 1a is maintained in the clamped state by the clamping parts 2 and 3. After the cutting, the cut pieces 1a are dropped downward by opening the clamping part 2 and 3 and are collected by a storage container 5. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007044806(A) 申请公布日期 2007.02.22
申请号 JP20050231411 申请日期 2005.08.09
申请人 TDK CORP 发明人 SAITO SHIGEO;SATO KAZUO;MITSUTAKE KOJI
分类号 B24B27/06;B24B41/06 主分类号 B24B27/06
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