| 摘要 |
PROBLEM TO BE SOLVED: To suppress peeling from an interface between a sealing resin and a semiconductor element when resin-sealing the semiconductor element that is flip-chip connected on a circuit board. SOLUTION: A rear surface 1b of a semiconductor element 1 is irradiated with laser beam, to form the layer of amorphous structure as a surface reforming layer. The semiconductor element 1 like this is flip-chip connected to a circuit board 5. Otherwise, after the semiconductor element is flip-chip connected to the circuit board 5, the rear surface of the semiconductor element is irradiated with laser beam to form a surface reforming layer. While the rear surface 1b of the semiconductor element 1 having a surface reforming layer is contacted to a sealing resin 7, the sealing resin 7 seals the semiconductor element 1. COPYRIGHT: (C)2007,JPO&INPIT
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